Daijiworld Media Network - Hyderabad

Hyderabad, Jan 12: Andhra Pradesh is set to become the epicentre of India’s semiconductor revolution with the signing of a Memorandum of Understanding (MoU) between Indichip Semiconductors Limited and their Japanese joint venture partner, Yitoa Micro Technology Limited (YMTL). The agreement, signed in Hyderabad, marks the establishment of India’s first private semiconductor manufacturing unit, with an investment exceeding Rs 14,000 cr.

The state-of-the-art facility will focus on the production of silicon carbide (SiC) chips, crucial for advancing energy-efficient technologies and supporting India’s sustainability goals. minister for Industries TG Bharath, highlighted the initiative’s alignment with the state's semiconductor policy unveiled in November 2024, which aims to make Andhra Pradesh a hub for electronics and semiconductor manufacturing.

Planned to produce 10,000 wafers per month initially, the facility’s capacity is expected to scale up to 50,000 wafers per month in the next two to three years. This strategic investment will address the growing global demand for clean energy solutions, electric vehicles, and renewable energy.

The signing ceremony was graced by key figures including Piyush Bichhoriya, managing director of Indichip, and Saikanth Varma, CEO of APEDB, along with IT minister Nara Lokesh and industries minister T G Bharath.

Lokesh emphasized Andhra Pradesh’s role in attracting cutting-edge industries through innovative policies, while Bichhoriya expressed the company’s dedication to contributing to nation-building and enhancing India’s manufacturing capabilities in the semiconductor industry.

The proposed facility will create thousands of jobs, boost regional innovation, and foster the growth of ancillary industries in the region. The state government will provide land and infrastructure for the project at the Orvakal Mega Industrial Hub in Kurnool, further positioning Andhra Pradesh as a leader in India’s semiconductor landscape.